The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production. Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications. Available as a fully automated system to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding. The FC150 accommodates a wide variety of processes and materials, including extremely fragile materials such as GaAs and HgCdTe. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Bond process changes are easily achieved.įINEPLACER® lambda Flexible Sub-micron Die BonderThe FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes.The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. More info on: FINEPLACER ® femto 2 Automated Sub-micron Die Bonder The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.

The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible. FLIPJET FJ520-ULTRASONIC FLIPCHIP BONDER The Flipjet FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform.

More info on: ESEC 2100 FC PLUS Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products. DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. DATACON 2200 EVO DATACON 2200 EVO MANUAL MANUEL FOR BESI DATACON EVO.

Dyno and Drag Strip measure horsepower (manual transmission only) and acceleration. Discover all the information about the product Flip-chip die bonder Datacon 2200 evo - BE Semiconductor Industries and find where you can buy it.

Datacon 2200 evo manual